Assignee
CHENG JUNG-WEI
TW·4 granted patents·1 pending application·28 citations·filing 2010–2012
Top patents by PatentIndex Score
5 records- 0193US8704354B2Package on package structures and methods for forming the sameCHENG JUNG WEI·Filed 2012·Granted Apr 22, 2014·14 cites·20 claims
- 0287US8658464B2Mold chase design for package-on-package applicationsCHENG JUNG WEI·Filed 2011·Granted Feb 25, 2014·10 cites·18 claims
- 0365US8991314B2Roller microcontact printing device and printing method thereofCHENG JUNG-WEI·Filed 2010·Granted Mar 31, 2015·4 cites·9 claims
- 0441US8671881B2Thickness adjustment device for thin-film coatingCHENG JUNG-WEI·Filed 2011·Granted Mar 18, 2014·0 cites·10 claims
- 0532US2012049173A1Organic Field Effect Transistor with Block Copolymer LayerCHENG JUNG-WEI·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →