Assignee
CHENG MING-DA
TW7 patents
Top patents by PatentIndex Score
US8659155B2Feb 25, 2014
Mechanisms for forming copper pillar bumps
CHENG MING-DA33 citations93
US9786622B2Oct 10, 2017
Semiconductor package
CHENG MING-DA5 citations72
US9538582B2Jan 3, 2017
Warpage control in the packaging of integrated circuits
CHENG MING-DA2 citations72
US8227334B2Jul 24, 2012
Doping minor elements into metal bumps
CHENG MING-DA3 citations62
US8501615B2Aug 6, 2013
Metal bump formation
CHENG MING-DA0 citations51
US8653592B2Feb 18, 2014
Isolation structure, non-volatile memory having the same, and method of fabricating the same
CHENG MING-DA0 citations50
US8067292B2Nov 29, 2011
Isolation structure, non-volatile memory having the same, and method of fabricating the same
CHENG MING-DA0 citations50