Assignee
CHENG TIEN-JEN
US·4 granted patents·2 pending applications·19 citations·filing 2006–2011
Top patents by PatentIndex Score
6 records- 0182US8415252B2Selective copper encapsulation layer depositionCHENG TIEN-JEN·Filed 2010·Granted Apr 9, 2013·7 cites·20 claims
- 0282US8105937B2Conformal adhesion promoter liner for metal interconnectsCHENG TIEN-JEN·Filed 2008·Granted Jan 31, 2012·8 cites·9 claims
- 0374US8444868B2Method for removing copper oxide layerCHENG TIEN-JEN·Filed 2010·Granted May 21, 2013·3 cites·19 claims
- 0473US9017486B2Deposition chamber cleaning method including stressed cleaning layerCHENG TIEN-JEN·Filed 2010·Granted Apr 28, 2015·1 cites·15 claims
- 0546US2006249854A1Device with area array pads for test probingCHENG TIEN-JEN·Filed 2006·Application pending·0 cites
- 0638US2013095649A1Chemical Bath ReplenishmentCHENG TIEN-JEN·Filed 2011·Application pending·0 cites
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