Assignee
CHERN CHYI-SHYUAN
TW·4 granted patents·5 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0175US8609446B2Method and apparatus for accurate die-to-wafer bondingCHERN CHYI SHYUAN·Filed 2011·Granted Dec 17, 2013·3 cites·20 claims
- 0264US8716128B2Methods of forming through silicon via openingsCHERN CHYI SHYUAN·Filed 2011·Granted May 6, 2014·1 cites·9 claims
- 0361US9099632B2Light emitting diode emitter substrate with highly reflective metal bondingCHERN CHYI SHYUAN·Filed 2012·Granted Aug 4, 2015·1 cites·20 claims
- 0437US9324624B2Optimizing light extraction efficiency for an LED waferCHERN CHYI-SHYUAN·Filed 2012·Granted Apr 26, 2016·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →