Assignee
CHEW HWEE-SENG JIMMY
SG·9 granted patents·32 citations·filing 2002–2012
Top patents by PatentIndex Score
9 records- 0191US8207608B2Interconnections for fine pitch semiconductor devices and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2007·Granted Jun 26, 2012·25 cites·26 claims
- 0277US8709874B2Manufacturing method for semiconductor device carrier and semiconductor package using the sameCHEW HWEE-SENG JIMMY·Filed 2011·Granted Apr 29, 2014·4 cites·28 claims
- 0367US8917521B2Etch-back type semiconductor package, substrate and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2011·Granted Dec 23, 2014·2 cites·23 claims
- 0464US8846519B2Interconnections for fine pitch semiconductor devices and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2012·Granted Sep 30, 2014·1 cites·17 claims
- 0550US8796844B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Aug 5, 2014·0 cites·30 claims
- 0649US9396982B2Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2008·Granted Jul 19, 2016·0 cites·10 claims
- 0746US8766438B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Jul 1, 2014·0 cites·22 claims
- 0845US9287157B2Semiconductor element for package miniaturizationCHEW HWEE-SENG JIMMY·Filed 2010·Granted Mar 15, 2016·0 cites·17 claims
- 0934US8791583B2Apparatus for molding a semiconductor wafer and process thereforCHEW HWEE SENG JIMMY·Filed 2002·Granted Jul 29, 2014·0 cites·26 claims
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