Assignee
CHIA YONG POO
SG·4 granted patents·27 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0193US8065792B2Method for packaging circuitsCHIA YONG POO·Filed 2010·Granted Nov 29, 2011·13 cites·18 claims
- 0287US8555495B2Method for packaging circuitsCHIA YONG POO·Filed 2011·Granted Oct 15, 2013·6 cites·20 claims
- 0379US8304894B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Nov 6, 2012·6 cites·31 claims
- 0467US8698295B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Apr 15, 2014·2 cites·20 claims
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