Assignee

CHIMEI CORP

TW2 patents

Top patents by PatentIndex Score

US11235563B2Feb 1, 2022

Resin composition, molded article, food contact appliance and food contact container

CHIMEI CORP0 citations55

US11106086B2Aug 31, 2021

Optical plate with protrusions, optical structure, backlight module and display device

CHIMEI CORP1 citations54