Assignee
CHINO TERUAKI
JP·4 granted patents·28 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0189US8536715B2Semiconductor device and method of manufacturing the sameCHINO TERUAKI·Filed 2012·Granted Sep 17, 2013·11 cites·5 claims
- 0285US8431441B2Semiconductor package and method of manufacturing sameCHINO TERUAKI·Filed 2011·Granted Apr 30, 2013·8 cites·12 claims
- 0384US8293576B2Semiconductor device and method of manufacturing the sameCHINO TERUAKI·Filed 2010·Granted Oct 23, 2012·7 cites·11 claims
- 0466US8436471B2Semiconductor package with its surface edge covered by resinCHINO TERUAKI·Filed 2010·Granted May 7, 2013·2 cites·7 claims
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