Assignee
CHIPBOND TECH CORP
TW·3 granted patents·1 pending application·8 citations·filing 2015–2016
Top patents by PatentIndex Score
4 records- 0182US9653376B1Heat dissipation package structureCHIPBOND TECH CORP·Filed 2016·Granted May 16, 2017·5 cites·14 claims
- 0272US9508676B1Semiconductor package structure having hollow chamber and bottom substrate and package process thereofCHIPBOND TECH CORP·Filed 2015·Granted Nov 29, 2016·3 cites·17 claims
- 0348US9510441B2Flexible substrateCHIPBOND TECH CORP·Filed 2015·Granted Nov 29, 2016·0 cites·7 claims
- 0428US2016318756A1Process for manufacturing semiconductor package having hollow chamberCHIPBOND TECH CORP·Filed 2015·Application pending·0 cites
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