Assignee
CHIPMOS TECHNOLOGIES BERMUDA
BM25 patents
Top patents by PatentIndex Score
US6853205B1Feb 8, 2005
Probe card assembly
CHIPMOS TECHNOLOGIES BERMUDA41 citations92
US6621710B1Sep 16, 2003
Modular probe card assembly
CHIPMOS TECHNOLOGIES BERMUDA29 citations92
US6703075B1Mar 9, 2004
Wafer treating method for making adhesive dies
CHIPMOS TECHNOLOGIES BERMUDA37 citations91
US7662672B2Feb 16, 2010
Manufacturing process of leadframe-based BGA packages
CHIPMOS TECHNOLOGIES BERMUDA20 citations90
US6686615B1Feb 3, 2004
Flip-chip type semiconductor device for reducing signal skew
CHIPMOS TECHNOLOGIES BERMUDA35 citations89
US7554197B2Jun 30, 2009
High frequency IC package and method for fabricating the same
CHIPMOS TECHNOLOGIES BERMUDA14 citations83
US7420267B2Sep 2, 2008
Image sensor assembly and method for fabricating the same
CHIPMOS TECHNOLOGIES BERMUDA9 citations83
US7372286B2May 13, 2008
Modular probe card
CHIPMOS TECHNOLOGIES BERMUDA17 citations83
US7952198B2May 31, 2011
BGA package with leads on chip
CHIPMOS TECHNOLOGIES BERMUDA7 citations82
US6689638B2Feb 10, 2004
Substrate-on-chip packaging process
CHIPMOS TECHNOLOGIES BERMUDA19 citations81
US7170160B1Jan 30, 2007
Chip structure and stacked-chip package
CHIPMOS TECHNOLOGIES BERMUDA14 citations76
US7498251B2Mar 3, 2009
Redistribution circuit structure
CHIPMOS TECHNOLOGIES BERMUDA10 citations75
US6812720B1Nov 2, 2004
Modularized probe card with coaxial transmitters
CHIPMOS TECHNOLOGIES BERMUDA11 citations73
US8030767B2Oct 4, 2011
Bump structure with annular support
CHIPMOS TECHNOLOGIES BERMUDA6 citations64
USRE42349EMay 10, 2011
Wafer treating method for making adhesive dies
CHIPMOS TECHNOLOGIES BERMUDA2 citations62
US7316065B2Jan 8, 2008
Method for fabricating a plurality of elastic probes in a row
CHIPMOS TECHNOLOGIES BERMUDA4 citations62
US7368809B2May 6, 2008
Pillar grid array package
CHIPMOS TECHNOLOGIES BERMUDA4 citations61
US7879653B2Feb 1, 2011
Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
CHIPMOS TECHNOLOGIES BERMUDA4 citations60
US7579676B2Aug 25, 2009
Leadless leadframe implemented in a leadframe-based BGA package
CHIPMOS TECHNOLOGIES BERMUDA5 citations60
US7741149B2Jun 22, 2010
Method of fabricating chip package structure
CHIPMOS TECHNOLOGIES BERMUDA6 citations56
US7648902B2Jan 19, 2010
Manufacturing method of redistribution circuit structure
CHIPMOS TECHNOLOGIES BERMUDA3 citations54
US7696443B2Apr 13, 2010
Electronic device with a warped spring connector
CHIPMOS TECHNOLOGIES BERMUDA0 citations51
US7370416B2May 13, 2008
Method of manufacturing an injector plate
CHIPMOS TECHNOLOGIES BERMUDA0 citations50
US7622806B2Nov 24, 2009
Laser mark on an IC component
CHIPMOS TECHNOLOGIES BERMUDA3 citations47
US7683462B2Mar 23, 2010
Chip package structure
CHIPMOS TECHNOLOGIES BERMUDA0 citations46