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CHIPPAC INC

US69 patents

Top patents by PatentIndex Score

US7101731B2Sep 5, 2006

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

CHIPPAC INC86 citations99

US7064426B2Jun 20, 2006

Semiconductor multi-package module having wire bond interconnect between stacked packages

CHIPPAC INC129 citations99

US7061088B2Jun 13, 2006

Semiconductor stacked multi-package module having inverted second package

CHIPPAC INC125 citations99

US7057269B2Jun 6, 2006

Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

CHIPPAC INC103 citations99

US7053477B2May 30, 2006

Semiconductor multi-package module having inverted bump chip carrier second package

CHIPPAC INC125 citations99

US7049691B2May 23, 2006

Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package

CHIPPAC INC100 citations99

US7045887B2May 16, 2006

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

CHIPPAC INC120 citations99

US7034387B2Apr 25, 2006

Semiconductor multipackage module including processor and memory package assemblies

CHIPPAC INC118 citations99

US6933598B2Aug 23, 2005

Semiconductor stacked multi-package module having inverted second package and electrically shielded first package

CHIPPAC INC190 citations99

US6906416B2Jun 14, 2005

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

CHIPPAC INC183 citations99

US6838761B2Jan 4, 2005

Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield

CHIPPAC INC222 citations99

US7253511B2Aug 7, 2007

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

CHIPPAC INC67 citations98

US7053476B2May 30, 2006

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

CHIPPAC INC103 citations98

US7033859B2Apr 25, 2006

Flip chip interconnection structure

CHIPPAC INC85 citations98

US6972481B2Dec 6, 2005

Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages

CHIPPAC INC118 citations98

US6815252B2Nov 9, 2004

Method of forming flip chip interconnection structure

CHIPPAC INC84 citations98

US7169642B2Jan 30, 2007

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

CHIPPAC INC47 citations97

US6967126B2Nov 22, 2005

Method for manufacturing plastic ball grid array with integral heatsink

CHIPPAC INC80 citations97

US7494847B2Feb 24, 2009

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

CHIPPAC INC18 citations96

US7368817B2May 6, 2008

Bump-on-lead flip chip interconnection

CHIPPAC INC24 citations96

US7364946B2Apr 29, 2008

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

CHIPPAC INC20 citations96

US7288434B2Oct 30, 2007

Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package

CHIPPAC INC28 citations96

US7247519B2Jul 24, 2007

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

CHIPPAC INC42 citations96

US7205647B2Apr 17, 2007

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

CHIPPAC INC50 citations96

US7166494B2Jan 23, 2007

Method of fabricating a semiconductor stacked multi-package module having inverted second package

CHIPPAC INC37 citations96

US7034391B2Apr 25, 2006

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

CHIPPAC INC24 citations93

US7358115B2Apr 15, 2008

Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides

CHIPPAC INC13 citations93

US7306973B2Dec 11, 2007

Method for making a semiconductor multipackage module including a processor and memory package assemblies

CHIPPAC INC31 citations93

US7279361B2Oct 9, 2007

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

CHIPPAC INC22 citations93

US7692279B2Apr 6, 2010

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

CHIPPAC INC18 citations92

US7453156B2Nov 18, 2008

Wire bond interconnection

CHIPPAC INC11 citations92

US6661083B2Dec 9, 2003

Plastic semiconductor package

CHIPPAC INC102 citations92

US6614123B2Sep 2, 2003

Plastic ball grid array package with integral heatsink

CHIPPAC INC18 citations92

US7671451B2Mar 2, 2010

Semiconductor package having double layer leadframe

CHIPPAC INC41 citations91

US7208821B2Apr 24, 2007

Multichip leadframe package

CHIPPAC INC19 citations89

US6828220B2Dec 7, 2004

Flip chip-in-leadframe package and process

CHIPPAC INC50 citations89

US6780682B2Aug 24, 2004

Process for precise encapsulation of flip chip interconnects

CHIPPAC INC42 citations89

US6737295B2May 18, 2004

Chip scale package with flip chip interconnect

CHIPPAC INC34 citations89

US7880313B2Feb 1, 2011

Semiconductor flip chip package having substantially non-collapsible spacer

CHIPPAC INC17 citations87

US8030134B2Oct 4, 2011

Stacked semiconductor package having adhesive/spacer structure and insulation

CHIPPAC INC10 citations84

US7650688B2Jan 26, 2010

Bonding tool for mounting semiconductor chips

CHIPPAC INC15 citations83

US7407080B2Aug 5, 2008

Wire bond capillary tip

CHIPPAC INC14 citations82

US7351610B2Apr 1, 2008

Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate

CHIPPAC INC7 citations82

US7691681B2Apr 6, 2010

Chip scale package having flip chip interconnect on die paddle

CHIPPAC INC11 citations81

US7436048B2Oct 14, 2008

Multichip leadframe package

CHIPPAC INC15 citations80

US7935572B2May 3, 2011

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

CHIPPAC INC6 citations74

US7829382B2Nov 9, 2010

Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

CHIPPAC INC5 citations74

Showing the top 50 of 69 patents by PatentIndex Score.

CHIPPAC INC

Top patents by PatentIndex Score

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Semiconductor multi-package module having wire bond interconnect between stacked packages

Semiconductor stacked multi-package module having inverted second package

Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Semiconductor multi-package module having inverted bump chip carrier second package

Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Semiconductor multipackage module including processor and memory package assemblies

Semiconductor stacked multi-package module having inverted second package and electrically shielded first package

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

Flip chip interconnection structure

Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages

Method of forming flip chip interconnection structure

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method for manufacturing plastic ball grid array with integral heatsink

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Bump-on-lead flip chip interconnection

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Method of fabricating a semiconductor stacked multi-package module having inverted second package

Flip chip interconnection pad layout

Tape ball grid array semiconductor package structure and assembly process

Self-coplanarity bumping shape for flip chip

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Wire bond interconnection

Plastic semiconductor package

Plastic ball grid array package with integral heatsink

Semiconductor package having double layer leadframe

Multichip leadframe package

Flip chip-in-leadframe package and process

Process for precise encapsulation of flip chip interconnects

Chip scale package with flip chip interconnect

Semiconductor flip chip package having substantially non-collapsible spacer

Stacked semiconductor package having adhesive/spacer structure and insulation

Bonding tool for mounting semiconductor chips

Wire bond capillary tip

Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate

Chip scale package having flip chip interconnect on die paddle

Multichip leadframe package

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package