Assignee
CHIPSCALE INC
US14 patents
Top patents by PatentIndex Score
US6221751B1Apr 24, 2001
Wafer fabrication of die-bottom contacts for electronic devices
CHIPSCALE INC203 citations98
US5910687AJun 8, 1999
Wafer fabrication of die-bottom contacts for electronic devices
CHIPSCALE INC198 citations98
US6051489AApr 18, 2000
Electronic component package with posts on the active side of the substrate
CHIPSCALE INC97 citations97
US5557149ASep 17, 1996
Semiconductor fabrication with contact processing for wrap-around flange interface
CHIPSCALE INC48 citations96
US6121119ASep 19, 2000
Resistor fabrication
CHIPSCALE INC38 citations92
US5656547AAug 12, 1997
Method for making a leadless surface mounted device with wrap-around flange interface contacts
CHIPSCALE INC40 citations92
US6355981B1Mar 12, 2002
Wafer fabrication of inside-wrapped contacts for electronic devices
CHIPSCALE INC26 citations90
US5904496AMay 18, 1999
Wafer fabrication of inside-wrapped contacts for electronic devices
CHIPSCALE INC31 citations90
US6414585B1Jul 2, 2002
Integrated passive components and package with posts
CHIPSCALE INC12 citations81
US6946734B2Sep 20, 2005
Integrated passive components and package with posts
CHIPSCALE INC5 citations73
US6833986B2Dec 21, 2004
Integrated passive components and package with posts
CHIPSCALE INC8 citations73
US5592022AJan 7, 1997
Fabricating a semiconductor with an insulative coating
CHIPSCALE INC12 citations73
US5789817AAug 4, 1998
Electrical apparatus with a metallic layer coupled to a lower region of a substrate and a metallic layer coupled to a lower region of a semiconductor device
CHIPSCALE INC5 citations71
US6954130B2Oct 11, 2005
Integrated passive components and package with posts
CHIPSCALE INC1 citations62