Assignee
CHIU CHIN-TIEN
TW·3 granted patents·5 pending applications·4 citations·filing 2005–2011
Top patents by PatentIndex Score
8 records- 0172US8487441B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingCHIU CHIN-TIEN·Filed 2007·Granted Jul 16, 2013·4 cites·11 claims
- 0244US2007158799A1Interconnected IC packages with vertical SMT padsCHIU CHIN-TIEN·Filed 2005·Application pending·0 cites
- 0342US2009085231A1Method of reducing memory card edge roughness by particle blastingCHIU CHIN-TIEN·Filed 2007·Application pending·0 cites
- 0441US2010044861A1Semiconductor die support in an offset die stackCHIU CHIN-TIEN·Filed 2008·Application pending·0 cites
- 0540US8878346B2Molded SiP package with reinforced solder columnsCHIU CHIN-TIEN·Filed 2006·Granted Nov 4, 2014·0 cites·24 claims
- 0638US2007096285A1Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor dieCHIU CHIN-TIEN·Filed 2005·Application pending·0 cites
- 0736US2012193802A1Glob top semiconductor packageCHIU CHIN-TIEN·Filed 2011·Application pending·0 cites
- 0834US9064836B1Extrinsic gettering on semiconductor devicesCHIU CHIN-TIEN·Filed 2010·Granted Jun 23, 2015·0 cites·11 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →