Assignee
CHO EUNG SAN
US·15 granted patents·117 citations·filing 2009–2012
Top patents by PatentIndex Score
15 records- 0196US8426952B2Stacked half-bridge package with a common conductive leadframeCHO EUNG SAN·Filed 2011·Granted Apr 23, 2013·25 cites·20 claims
- 0294US8497574B2High power semiconductor package with conductive clips and flip chip driver ICCHO EUNG SAN·Filed 2011·Granted Jul 30, 2013·12 cites·20 claims
- 0393US8664754B2High power semiconductor package with multiple conductive clipsCHO EUNG SAN·Filed 2011·Granted Mar 4, 2014·11 cites·20 claims
- 0493US8497573B2High power semiconductor package with conductive clip on multiple transistorsCHO EUNG SAN·Filed 2011·Granted Jul 30, 2013·10 cites·20 claims
- 0592US8445999B2Direct contact leadless packageCHO EUNG SAN·Filed 2011·Granted May 21, 2013·10 cites·20 claims
- 0691US8531016B2Thermally enhanced semiconductor package with exposed parallel conductive clipCHO EUNG SAN·Filed 2011·Granted Sep 10, 2013·9 cites·20 claims
- 0790US8093695B2Direct contact leadless flip chip package for high current devicesCHO EUNG SAN·Filed 2009·Granted Jan 10, 2012·15 cites·16 claims
- 0885US8674497B2Stacked half-bridge package with a current carrying layerCHO EUNG SAN·Filed 2011·Granted Mar 18, 2014·6 cites·20 claims
- 0984US8749034B2High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistorCHO EUNG SAN·Filed 2011·Granted Jun 10, 2014·4 cites·16 claims
- 1084US8614503B2Common drain exposed conductive clip for high power semiconductor packagesCHO EUNG SAN·Filed 2011·Granted Dec 24, 2013·7 cites·20 claims
- 1181US8680627B2Stacked half-bridge package with a common conductive clipCHO EUNG SAN·Filed 2011·Granted Mar 25, 2014·4 cites·20 claims
- 1272US8575737B2Direct contact semiconductor package with power transistorCHO EUNG SAN·Filed 2012·Granted Nov 5, 2013·2 cites·16 claims
- 1367US8319321B2Leadless package for high current devicesCHO EUNG SAN·Filed 2011·Granted Nov 27, 2012·1 cites·12 claims
- 1464US8575736B2Direct contact flip chip package with power transistorsCHO EUNG SAN·Filed 2012·Granted Nov 5, 2013·1 cites·18 claims
- 1554US8896107B2High power semiconductor package with conductive clipCHO EUNG SAN·Filed 2011·Granted Nov 25, 2014·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →