Assignee
CHO YUN-RAE
KR·5 granted patents·173 citations·filing 2009–2015
Top patents by PatentIndex Score
5 records- 0197US8143710B2Wafer-level chip-on-chip package, package on package, and methods of manufacturing the sameCHO YUN-RAE·Filed 2009·Granted Mar 27, 2012·131 cites·13 claims
- 0291US8232631B2Semiconductor packing having offset stack structureCHO YUN-RAE·Filed 2009·Granted Jul 31, 2012·24 cites·16 claims
- 0390US8664757B2High density chip stacked package, package-on-package and method of fabricating the sameCHO YUN-RAE·Filed 2011·Granted Mar 4, 2014·14 cites·17 claims
- 0476US8946909B2Semiconductor package having gap-filler injection-friendly structureCHO YUN-RAE·Filed 2011·Granted Feb 3, 2015·4 cites·20 claims
- 0541US9543275B2Semiconductor package with a lead, package-on-package device including the same, and mobile device including the sameCHO YUN-RAE·Filed 2015·Granted Jan 10, 2017·0 cites·5 claims
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