Assignee
CHOI A LEAM
KR·6 granted patents·1 pending application·10 citations·filing 2009–2011
Top patents by PatentIndex Score
7 records- 0173US8183089B2Method for manufacturing package system incorporating flip-chip assemblyCHOI A LEAM·Filed 2010·Granted May 22, 2012·3 cites·10 claims
- 0270US8080446B2Integrated circuit packaging system with interposer interconnections and method of manufacture thereofCHOI A LEAM·Filed 2009·Granted Dec 20, 2011·4 cites·20 claims
- 0361US8558366B2Integrated circuit packaging system with interposer interconnections and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Oct 15, 2013·1 cites·20 claims
- 0459US8970044B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Mar 3, 2015·1 cites·20 claims
- 0559US8699232B2Integrated circuit packaging system with interposer and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Apr 15, 2014·1 cites·9 claims
- 0647US8093100B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofCHOI A LEAM·Filed 2010·Granted Jan 10, 2012·0 cites·20 claims
- 0737US2012223435A1Integrated circuit packaging system with leads and method of manufacture thereofCHOI A LEAM·Filed 2011·Application pending·0 cites
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