Assignee
CHOI KYOUNG-SEI
KR·4 granted patents·12 citations·filing 2004–2012
Top patents by PatentIndex Score
4 records- 0189US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0250US8796158B2Methods for forming circuit pattern forming region in an insulating substrateCHOI KYOUNG-SEI·Filed 2012·Granted Aug 5, 2014·0 cites·20 claims
- 0349US8250750B2Method for manufacturing tape wiring boardCHOI KYOUNG-SEI·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 0446US8110918B2Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrateCHOI KYOUNG-SEI·Filed 2004·Granted Feb 7, 2012·2 cites·49 claims
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