Assignee
CHOI WON KYOUNG
SG·8 granted patents·49 citations·filing 2007–2015
Top patents by PatentIndex Score
8 records- 0196US8435881B2Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidationCHOI WON KYOUNG·Filed 2011·Granted May 7, 2013·33 cites·30 claims
- 0289US8742591B2Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress reliefCHOI WON KYOUNG·Filed 2011·Granted Jun 3, 2014·10 cites·22 claims
- 0381US8587120B2Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structureCHOI WON KYOUNG·Filed 2011·Granted Nov 19, 2013·4 cites·25 claims
- 0467US8517249B2Soldering structure and method using ZnCHOI WON-KYOUNG·Filed 2007·Granted Aug 27, 2013·2 cites·7 claims
- 0556US9076724B1Integrated circuit system with debonding adhesive and method of manufacture thereofCHOI WON KYOUNG·Filed 2013·Granted Jul 7, 2015·0 cites·18 claims
- 0652US9355993B2Integrated circuit system with debonding adhesive and method of manufacture thereofCHOI WON KYOUNG·Filed 2015·Granted May 31, 2016·0 cites·17 claims
- 0749US8809191B2Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor waferCHOI WON KYOUNG·Filed 2011·Granted Aug 19, 2014·0 cites·27 claims
- 0843US8787950B2Mobile terminal and method for transmitting message thereofCHOI WON KYOUNG·Filed 2011·Granted Jul 22, 2014·0 cites·14 claims
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