Assignee
CHOU PAO-HUNG
TW·3 granted patents·1 pending application·8 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0181US9093459B2Package structure having a semiconductor component embedded therein and method of fabricating the sameCHOU PAO-HUNG·Filed 2011·Granted Jul 28, 2015·5 cites·10 claims
- 0258US8222528B2Circuit board structure for electrical testing and fabrication method thereofCHOU PAO-HUNG·Filed 2008·Granted Jul 17, 2012·1 cites·8 claims
- 0355US9230895B2Package substrate and fabrication method thereofCHOU PAO-HUNG·Filed 2011·Granted Jan 5, 2016·2 cites·3 claims
- 0429US2012097430A1Packaging substrate and method of fabricating the sameCHOU PAO-HUNG·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →