Assignee
CHOU SHIH-WEN
TW·1 granted patent·4 pending applications·2 citations·filing 2006–2011
Technology mixH10W5
Top patents by PatentIndex Score
5 records- 0159US8309401B2Method of manufacturing non-leaded package structureCHOU SHIH-WEN·Filed 2011·Granted Nov 13, 2012·2 cites·10 claims
- 0242US2007228581A1Universal chip package structureCHOU SHIH-WEN·Filed 2007·Application pending·0 cites
- 0340US2007080466A1Universal chip package structureCHOU SHIH-WEN·Filed 2006·Application pending·0 cites
- 0439US2008283981A1Chip-On-Lead and Lead-On-Chip Stacked StructureCHOU SHIH-WEN·Filed 2008·Application pending·0 cites
- 0533US2012241935A1Package-on-package structureCHOU SHIH-WEN·Filed 2011·Application pending·0 cites
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