Assignee
CHOW SENG GUAN
SG·30 granted patents·365 citations·filing 2006–2012
Top patents by PatentIndex Score
30 records- 0197US8685792B2Integrated circuit package system with interposerCHOW SENG GUAN·Filed 2008·Granted Apr 1, 2014·52 cites·10 claims
- 0297US8278141B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2008·Granted Oct 2, 2012·54 cites·19 claims
- 0397US8258015B2Integrated circuit package system with penetrable film adhesiveCHOW SENG GUAN·Filed 2008·Granted Sep 4, 2012·55 cites·24 claims
- 0496US8106500B2Stackable integrated circuit package systemCHOW SENG GUAN·Filed 2010·Granted Jan 31, 2012·28 cites·10 claims
- 0594US9252172B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionCHOW SENG GUAN·Filed 2011·Granted Feb 2, 2016·34 cites·18 claims
- 0694US8304880B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Nov 6, 2012·22 cites·20 claims
- 0793US8624364B2Integrated circuit packaging system with encapsulation connector and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Jan 7, 2014·17 cites·20 claims
- 0890US8163600B2Bridge stack integrated circuit package-on-package systemCHOW SENG GUAN·Filed 2006·Granted Apr 24, 2012·20 cites·14 claims
- 0985US8704349B2Integrated circuit package system with exposed interconnectsCHOW SENG GUAN·Filed 2006·Granted Apr 22, 2014·14 cites·8 claims
- 1085US8507319B2Integrated circuit package system with shieldCHOW SENG GUAN·Filed 2007·Granted Aug 13, 2013·13 cites·20 claims
- 1184US8102040B2Integrated circuit package system with die and package combinationCHOW SENG GUAN·Filed 2009·Granted Jan 24, 2012·10 cites·17 claims
- 1279US8138590B2Integrated circuit package system with wire-in-film encapsulationCHOW SENG GUAN·Filed 2008·Granted Mar 20, 2012·8 cites·20 claims
- 1377US8999754B2Integrated circuit package with molded cavityCHOW SENG GUAN·Filed 2012·Granted Apr 7, 2015·3 cites·22 claims
- 1475US9030006B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2012·Granted May 12, 2015·3 cites·20 claims
- 1573US8422243B2Integrated circuit package system employing a support structure with a recessCHOW SENG GUAN·Filed 2006·Granted Apr 16, 2013·5 cites·10 claims
- 1673US8198735B2Integrated circuit package with molded cavityCHOW SENG GUAN·Filed 2007·Granted Jun 12, 2012·4 cites·12 claims
- 1772US8232658B2Stackable integrated circuit package system with multiple interconnect interfaceCHOW SENG GUAN·Filed 2008·Granted Jul 31, 2012·4 cites·20 claims
- 1867US8604602B2Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Dec 10, 2013·2 cites·20 claims
- 1967US8188586B2Mountable integrated circuit package system with mounting interconnectsCHOW SENG GUAN·Filed 2007·Granted May 29, 2012·3 cites·25 claims
- 2067US8183675B2Integrated circuit package-on-package system with anti-mold flash featureCHOW SENG GUAN·Filed 2007·Granted May 22, 2012·3 cites·20 claims
- 2167US8084849B2Integrated circuit package system with offset stackingCHOW SENG GUAN·Filed 2007·Granted Dec 27, 2011·3 cites·20 claims
- 2264US9171769B2Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor packageCHOW SENG GUAN·Filed 2010·Granted Oct 27, 2015·2 cites·21 claims
- 2364US8143711B2Integrated circuit package system with offset stacking and anti-flash structureCHOW SENG GUAN·Filed 2010·Granted Mar 27, 2012·1 cites·10 claims
- 2463US8124460B2Integrated circuit package system employing an exposed thermally conductive coatingCHOW SENG GUAN·Filed 2006·Granted Feb 28, 2012·2 cites·15 claims
- 2563US8080885B2Integrated circuit packaging system with multi level contact and method of manufacture thereofCHOW SENG GUAN·Filed 2008·Granted Dec 20, 2011·2 cites·20 claims
- 2659US9084377B2Integrated circuit package system with mounting features for clearanceCHOW SENG GUAN·Filed 2007·Granted Jul 14, 2015·1 cites·5 claims
- 2755US8129231B2Method of manufacture for semiconductor package with flow controllerCHOW SENG GUAN·Filed 2009·Granted Mar 6, 2012·0 cites·17 claims
- 2850US8587098B2Integrated circuit protruding pad package system and method for manufacturing thereofCHOW SENG GUAN·Filed 2011·Granted Nov 19, 2013·0 cites·12 claims
- 2947US9293350B2Semiconductor package system with cavity substrate and manufacturing method thereforCHOW SENG GUAN·Filed 2008·Granted Mar 22, 2016·0 cites·20 claims
- 3045US8420950B2Circuit system with leads and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Apr 16, 2013·0 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →