Assignee
CHUNG HYUN-SOO
KR·7 granted patents·1 pending application·26 citations·filing 2003–2012
Top patents by PatentIndex Score
8 records- 0191US8735276B2Semiconductor packages and methods of manufacturing the sameCHUNG HYUN-SOO·Filed 2012·Granted May 27, 2014·14 cites·20 claims
- 0285US8426252B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Apr 23, 2013·5 cites·16 claims
- 0369US8110922B2Wafer level semiconductor module and method for manufacturing the sameCHUNG HYUN-SOO·Filed 2009·Granted Feb 7, 2012·3 cites·15 claims
- 0466US8232644B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Jul 31, 2012·1 cites·29 claims
- 0566US8120177B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2010·Granted Feb 21, 2012·1 cites·28 claims
- 0656US7740145B2Bottle capCHUNG HYUN-SOO·Filed 2003·Granted Jun 22, 2010·2 cites·13 claims
- 0747US8111520B2Semiconductor moduleCHUNG HYUN-SOO·Filed 2008·Granted Feb 7, 2012·0 cites·4 claims
- 0840US2006038291A1Electrode structure of a semiconductor device and method of manufacturing the sameCHUNG HYUN-SOO·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →