Assignee
CHUNG QWAN HO
KR·3 granted patents·4 pending applications·5 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0168US8710652B2Embedded package and method for manufacturing the sameCHUNG QWAN HO·Filed 2011·Granted Apr 29, 2014·2 cites·11 claims
- 0265US8264087B2Semiconductor package for discharging heat and method for fabricating the sameCHUNG QWAN HO·Filed 2009·Granted Sep 11, 2012·3 cites·12 claims
- 0353US2009261469A1Semiconductor package and method for manufacturing the sameCHUNG QWAN HO·Filed 2008·Application pending·0 cites
- 0449US8399294B2Semiconductor package for discharging heat and method for fabricating the sameCHUNG QWAN HO·Filed 2012·Granted Mar 19, 2013·0 cites·4 claims
- 0548US2009001602A1Stack package that prevents warping and cracking of a wafer and semiconductor chip and method for manufacturing the sameCHUNG QWAN HO·Filed 2007·Application pending·0 cites
- 0647US2012208325A1Semiconductor package and method for manufacturing the sameCHUNG QWAN HO·Filed 2012·Application pending·0 cites
- 0743US2009057870A1Stacked semiconductor package with a reduced volumeCHUNG QWAN HO·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →