Assignee
CIRCUIT FOIL JAPAN
JP·5 granted patents·186 citations·filing 1996–2005
Top patents by PatentIndex Score
5 records- 0196US7175920B2Copper foil for high-density ultra-fine printed wiring boardCIRCUIT FOIL JAPAN·Filed 2005·Granted Feb 13, 2007·25 cites·17 claims
- 0293US7026059B2Copper foil for high-density ultrafine printed wiring boadCIRCUIT FOIL JAPAN·Filed 2001·Granted Apr 11, 2006·36 cites·28 claims
- 0387US5834140AElectrodeposited copper foil for fine pattern and method for producing the sameCIRCUIT FOIL JAPAN·Filed 1996·Granted Nov 10, 1998·78 cites·15 claims
- 0462US5792333AMethod of surface-roughening treatment of copper foilCIRCUIT FOIL JAPAN·Filed 1997·Granted Aug 11, 1998·25 cites·21 claims
- 0550US6153077AProcess for preparing porous electrolytic metal foilCIRCUIT FOIL JAPAN·Filed 1996·Granted Nov 28, 2000·22 cites·13 claims
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