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CO REYNALDO
US3 patents
Top patents by PatentIndex Score
US8680687B2Mar 25, 2014
Electrical interconnect for die stacked in zig-zag configuration
CO REYNALDO7 citations81
US9153517B2Oct 6, 2015
Electrical connector between die pad and z-interconnect for stacked die assemblies
CO REYNALDO5 citations79
US8884403B2Nov 11, 2014
Semiconductor die array structure
CO REYNALDO2 citations60