Assignee
COMPEQ MANUFACTURING COMPANY L
TW·6 granted patents·208 citations·filing 1997–1998
Top patents by PatentIndex Score
6 records- 0186US5830800APackaging method for a ball grid array integrated circuit without utilizing a base plateCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Nov 3, 1998·87 cites·7 claims
- 0277US5882957ABall grid array packaging method for an integrated circuit and structure realized by the methodCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Mar 16, 1999·53 cites·9 claims
- 0367US5884396ATransfer flat type ball grid array method for manufacturing packaging substrateCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Mar 23, 1999·35 cites·7 claims
- 0454US5843806AMethods for packaging tab-BGA integrated circuitsCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Dec 1, 1998·25 cites·12 claims
- 0534US5763294ASolid tape automated bonding packaging methodCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Jun 9, 1998·4 cites·7 claims
- 0632US6057179AMethod and structure for packaging an integrated circuit with readily removed excess encapsulant on degating regionCOMPEQ MANUFACTURING COMPANY L·Filed 1998·Granted May 2, 2000·4 cites·28 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →