Assignee
CONNECTEC JAPAN CORP
JP·6 granted patents·1 pending application·0 citations·filing 2018–2023
Top patents by PatentIndex Score
7 records- 0159US2026027751A1Method for manufacturing master mold for imprintingCONNECTEC JAPAN CORP·Filed 2023·Application pending·0 cites
- 0253US12181796B2Wiring formation method and transfer mold manufacturing methodCONNECTEC JAPAN CORP·Filed 2021·Granted Dec 31, 2024·0 cites·14 claims
- 0353US11495045B2Image acquiring apparatus and display apparatus equipped therewithCONNECTEC JAPAN CORP·Filed 2020·Granted Nov 8, 2022·0 cites·5 claims
- 0450US11113503B2Fingerprint sensor and display deviceCONNECTEC JAPAN CORP·Filed 2018·Granted Sep 7, 2021·0 cites·8 claims
- 0547US12500121B2Method for forming wiring on semiconductor deviceCONNECTEC JAPAN CORP·Filed 2020·Granted Dec 16, 2025·0 cites·5 claims
- 0647US11586175B2Tool, task management device, task management method, and task management systemCONNECTEC JAPAN CORP·Filed 2018·Granted Feb 21, 2023·0 cites·3 claims
- 0741US12414712B2Information processing systemCONNECTEC JAPAN CORP·Filed 2018·Granted Sep 16, 2025·0 cites·8 claims
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