Assignee
COOKSON ELECTRONICS INC
US·3 granted patents·8 pending applications·80 citations·filing 2002–2004
Top patents by PatentIndex Score
11 records- 0184US6936644B2Releasable microcapsule and adhesive curing system using the sameCOOKSON ELECTRONICS INC·Filed 2002·Granted Aug 30, 2005·39 cites·42 claims
- 0273US6881074B1Electrical circuit assembly with micro-socketCOOKSON ELECTRONICS INC·Filed 2003·Granted Apr 19, 2005·36 cites·40 claims
- 0352US6838372B2Via interconnect forming process and electronic component product thereofCOOKSON ELECTRONICS INC·Filed 2002·Granted Jan 4, 2005·5 cites·67 claims
- 0443US2005012191A1Reconnectable chip interface and chip packageCOOKSON ELECTRONICS INC·Filed 2004·Application pending·0 cites
- 0541US2005012212A1Reconnectable chip interface and chip packageCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 0639US2005056946A1Electrical circuit assembly with improved shock resistanceCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 0738US2006035413A1Thermal protection for electronic components during processingCOOKSON ELECTRONICS INC·Filed 2004·Application pending·0 cites
- 0837US2005151554A1Cooling devices and methods of using themCOOKSON ELECTRONICS INC·Filed 2004·Application pending·0 cites
- 0937US2004108588A1Package for microchipsCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 1036US2004163717A1MEMS device assemblyCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 1133US2005151555A1Cooling devices and methods of using themCOOKSON ELECTRONICS INC·Filed 2004·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →