Assignee
COOKSON SINGAPORE PTE LTD
US·1 granted patent·2 pending applications·28 citations·filing 2001–2006
Top patents by PatentIndex Score
3 records- 0176US6437026B1Hardener for epoxy molding compoundsCOOKSON SINGAPORE PTE LTD·Filed 2001·Granted Aug 20, 2002·28 cites·25 claims
- 0236US2007020810A1Thermoplastic/thermoset composition material and method of attaching a wafer to a substrateCOOKSON SINGAPORE PTE LTD·Filed 2006·Application pending·0 cites
- 0329US2007073008A1Compositions effective to suppress void formationCOOKSON SINGAPORE PTE LTD·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →