Assignee
DAI MING-JI
TW·3 granted patents·94 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0194US8075182B2Apparatus and method for measuring characteristic and chip temperature of LEDDAI MING-JI·Filed 2008·Granted Dec 13, 2011·64 cites·22 claims
- 0289US8609454B2Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devicesDAI MING-JI·Filed 2012·Granted Dec 17, 2013·20 cites·22 claims
- 0385US8456017B2Filled through-silicon via with conductive composite materialDAI MING-JI·Filed 2011·Granted Jun 4, 2013·10 cites·20 claims
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