Assignee
DAIKEN IND LTD
JP·10 granted patents·1 pending application·182 citations·filing 1988–2025
Top patents by PatentIndex Score
11 records- 0192US5739650AMotor system capable of obtaining high efficiency and method for controlling a motorDAIKEN IND LTD·Filed 1995·Granted Apr 14, 1998·100 cites·36 claims
- 0286US7173393B2Phase current detection method, inverter control method, motor control method, and apparatuses used in these methodsDAIKEN IND LTD·Filed 2002·Granted Feb 6, 2007·42 cites·42 claims
- 0373US6591631B1Refrigerating deviceDAIKEN IND LTD·Filed 2000·Granted Jul 15, 2003·19 cites·4 claims
- 0458US2025230610A1Water- and oil-repellent agentDAIKEN IND LTD·Filed 2025·Application pending·0 cites
- 0555US6180840B1Method of producing 1,1,1,2,2-pentafluoroethane a method of producing 2,-2,-diohloro-1,1,1-trifluorethane and a method of purifying 1,1,1,2 pentafluoroethaneDAIKEN IND LTD·Filed 1998·Granted Jan 30, 2001·5 cites·1 claims
- 0652US5202360AFluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compoundDAIKEN IND LTD·Filed 1991·Granted Apr 13, 1993·4 cites·2 claims
- 0747US6776350B2Remote controller for air conditioner and air conditionerDAIKEN IND LTD·Filed 2001·Granted Aug 17, 2004·4 cites·4 claims
- 0846US7704692B1Process for detecting toxic substancesDAIKEN IND LTD·Filed 2007·Granted Apr 27, 2010·0 cites·4 claims
- 0945US4788327A4,4'-(perfluoroisopropylidene)dicyclohexanol, derivative thereof and process for preparing the sameDAIKEN IND LTD·Filed 1988·Granted Nov 29, 1988·2 cites·5 claims
- 1035US6663924B1Packaging material for molding material and parts for semiconductor production apparatuses, method for packaging by using same and packaged molding material and parts for semiconductor production apparatusesDAIKEN IND LTD·Filed 1999·Granted Dec 16, 2003·6 cites·13 claims
- 1130US5437805AParticles containing iron carbideDAIKEN IND LTD·Filed 1993·Granted Aug 1, 1995·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →