Assignee
DANG BING
US·10 granted patents·2 pending applications·60 citations·filing 2007–2012
Top patents by PatentIndex Score
12 records- 0189US8419895B2Laser ablation for integrated circuit fabricationDANG BING·Filed 2010·Granted Apr 16, 2013·11 cites·20 claims
- 0287US8518829B2Self-sealed fluidic channels for nanopore arrayDANG BING·Filed 2011·Granted Aug 27, 2013·16 cites·17 claims
- 0386US8912045B2Three dimensional flip chip system and methodDANG BING·Filed 2012·Granted Dec 16, 2014·7 cites·1 claims
- 0484US8679280B2Laser ablation of adhesive for integrated circuit fabricationDANG BING·Filed 2010·Granted Mar 25, 2014·7 cites·19 claims
- 0582US8689437B2Method for forming integrated circuit assemblyDANG BING·Filed 2009·Granted Apr 8, 2014·11 cites·20 claims
- 0680US8525168B2Integrated circuit (IC) test probeDANG BING·Filed 2011·Granted Sep 3, 2013·5 cites·25 claims
- 0770US8148255B2Techniques for forming solder bump interconnectsDANG BING·Filed 2007·Granted Apr 3, 2012·2 cites·19 claims
- 0863US9273408B2Direct injection molded solder process for forming solder bumps on wafersDANG BING·Filed 2012·Granted Mar 1, 2016·1 cites·8 claims
- 0956US8927988B2Self-sealed fluidic channels for a nanopore arrayDANG BING·Filed 2012·Granted Jan 6, 2015·0 cites·6 claims
- 1056US8328156B2Techniques for forming solder bump interconnectsDANG BING·Filed 2012·Granted Dec 11, 2012·0 cites·2 claims
- 1149US2013327811A1Three dimensional flip chip system and methodDANG BING·Filed 2012·Application pending·0 cites
- 1248US2009085202A1Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si InterposerDANG BING·Filed 2007·Application pending·0 cites
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