Assignee
DAS RABINDRA N
US·14 granted patents·3 pending applications·89 citations·filing 2007–2012
Top patents by PatentIndex Score
17 records- 0196US8446707B1Circuitized substrate with low loss capacitive material and method of making sameDAS RABINDRA N·Filed 2011·Granted May 21, 2013·18 cites·11 claims
- 0294US8143530B1Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substratesDAS RABINDRA N·Filed 2010·Granted Mar 27, 2012·18 cites·10 claims
- 0392US8288857B2Anti-tamper microchip package based on thermal nanofluids or fluidsDAS RABINDRA N·Filed 2010·Granted Oct 16, 2012·16 cites·25 claims
- 0491US8607445B1Substrate having internal capacitor and method of making sameDAS RABINDRA N·Filed 2012·Granted Dec 17, 2013·12 cites·19 claims
- 0590US8063315B2Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrateDAS RABINDRA N·Filed 2007·Granted Nov 22, 2011·15 cites·17 claims
- 0676US9451693B2Electrically conductive adhesive (ECA) for multilayer device interconnectsDAS RABINDRA N·Filed 2011·Granted Sep 20, 2016·2 cites·43 claims
- 0775US8247703B2Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrateDAS RABINDRA N·Filed 2010·Granted Aug 21, 2012·2 cites·12 claims
- 0870US8501575B2Method of forming multilayer capacitors in a printed circuit substrateDAS RABINDRA N·Filed 2010·Granted Aug 6, 2013·2 cites·4 claims
- 0966US8499445B1Method of forming an electrically conductive printed lineDAS RABINDRA N·Filed 2011·Granted Aug 6, 2013·1 cites·26 claims
- 1066US8144480B2Multi-layer embedded capacitance and resistance substrate coreDAS RABINDRA N·Filed 2010·Granted Mar 27, 2012·2 cites·6 claims
- 1162US9420689B2Method of making a circuitized substrateDAS RABINDRA N·Filed 2009·Granted Aug 16, 2016·1 cites·8 claims
- 1252US9756724B2Method of making a circuitized substrateDAS RABINDRA N·Filed 2011·Granted Sep 5, 2017·0 cites·9 claims
- 1347US8299371B2Circuitized substrate with dielectric interposer assembly and methodDAS RABINDRA N·Filed 2010·Granted Oct 30, 2012·0 cites·10 claims
- 1444US2012228014A1Circuitized substrate with internal thin film capacitor and method of making sameDAS RABINDRA N·Filed 2011·Application pending·0 cites
- 1543US8685284B2Conducting paste for device level interconnectsDAS RABINDRA N·Filed 2010·Granted Apr 1, 2014·0 cites·9 claims
- 1642US2012257343A1Conductive metal micro-pillars for enhanced electrical interconnectionDAS RABINDRA N·Filed 2011·Application pending·0 cites
- 1738US2012162928A1Electronic package and method of making sameDAS RABINDRA N·Filed 2010·Application pending·0 cites
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