Assignee
DAUBENSPECK TIMOTHY HARRISON
US·4 granted patents·4 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0170US8138602B2Solder interconnect pads with current spreading layersDAUBENSPECK TIMOTHY HARRISON·Filed 2010·Granted Mar 20, 2012·2 cites·6 claims
- 0264US8575007B2Selective electromigration improvement for high current C4sDAUBENSPECK TIMOTHY HARRISON·Filed 2011·Granted Nov 5, 2013·2 cites·5 claims
- 0345US8819933B2Method for forming a current distribution structureDAUBENSPECK TIMOTHY HARRISON·Filed 2010·Granted Sep 2, 2014·0 cites·15 claims
- 0442US9105465B2Wafer edge conditioning for thinned wafersDAUBENSPECK TIMOTHY HARRISON·Filed 2011·Granted Aug 11, 2015·0 cites·8 claims
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