Assignee
DEJIMA HIROHISA
JP·0 granted patents·2 pending applications·0 citations·filing 2010–2010
Top patents by PatentIndex Score
2 records- 0142US2012032284A1Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing sameDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 0229US2011304034A1Semiconductor wafer bonding product, method of manufacturing semiconductor wafer bonding product and semiconductor deviceDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
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