Assignee
DEOPURA MANISH
US·2 granted patents·1 pending application·64 citations·filing 2007–2014
Top patents by PatentIndex Score
3 records- 0195US8932116B2Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designsDEOPURA MANISH·Filed 2012·Granted Jan 13, 2015·28 cites·5 claims
- 0295US8287793B2Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designsDEOPURA MANISH·Filed 2007·Granted Oct 16, 2012·36 cites·11 claims
- 0358US2015093977A1Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designsDEOPURA MANISH·Filed 2014·Application pending·0 cites
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