Assignee
DEVIPACK OY
FI·2 granted patents·24 citations·filing 1991–1994
Top patents by PatentIndex Score
2 records- 0155US5698293AFormed piece particularly for use as packing material method and apparatus for its manufacture and useDEVIPACK OY·Filed 1994·Granted Dec 16, 1997·22 cites·16 claims
- 0219US5248039APackage blank and method for producing a packageDEVIPACK OY·Filed 1991·Granted Sep 28, 1993·2 cites·14 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →