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DI ZENGFENG
CN
2 patents
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US8877608B2
Nov 4, 2014
Method for preparing GOI chip structure
DI ZENGFENG
6 citations
68
US9230849B2
Jan 5, 2016
Method for preparing ultra-thin material on insulator through adsorption by doped ultra-thin layer
DI ZENGFENG
0 citations
35