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DIEP BUU
US4 patents
Top patents by PatentIndex Score
US8454789B2Jun 4, 2013
Disposable bond gap control structures
DIEP BUU6 citations82
US8844793B2Sep 30, 2014
Reducing formation of oxide on solder
DIEP BUU4 citations71
US8980676B2Mar 17, 2015
Fabrication of window cavity cap structures in wafer level packaging
DIEP BUU2 citations60
US8393526B2Mar 12, 2013
System and method for packaging electronic devices
DIEP BUU2 citations59