Assignee
DING XIAOYI
US5 patents
Top patents by PatentIndex Score
US8215176B2Jul 10, 2012
Pressure sensor for harsh media sensing and flexible packaging
DING XIAOYI45 citations92
US8791540B2Jul 29, 2014
Thin semiconductor device having embedded die support and methods of making the same
DING XIAOYI1 citations61
US8791539B2Jul 29, 2014
Thin semiconductor device having embedded die support and methods of making the same
DING XIAOYI1 citations61
US8164153B2Apr 24, 2012
Thin semiconductor device having embedded die support and methods of making the same
DING XIAOYI2 citations61
US8618675B2Dec 31, 2013
Thin semiconductor die package
DING XIAOYI4 citations53