Assignee
DOURIET DANIEL
US·1 granted patent·1 pending application·2 citations·filing 2006–2010
Top patents by PatentIndex Score
2 records- 0168US8586476B2Fabrication method for circuit substrate having post-fed die side power supply connectionsDOURIET DANIEL·Filed 2010·Granted Nov 19, 2013·2 cites·11 claims
- 0239US2008109773A1Analyzing Impedance Discontinuities In A Printed Circuit BoardDOURIET DANIEL·Filed 2006·Application pending·0 cites
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