Assignee
DUPONT AIR PROD NANOMATERIALS
US·27 granted patents·6 pending applications·554 citations·filing 2002–2011
Top patents by PatentIndex Score
33 records- 0193US7691287B2Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarizationDUPONT AIR PROD NANOMATERIALS·Filed 2007·Granted Apr 6, 2010·20 cites·12 claims
- 0292US7429338B2Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarizationDUPONT AIR PROD NANOMATERIALS·Filed 2006·Granted Sep 30, 2008·17 cites·13 claims
- 0392US7077880B2Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarizationDUPONT AIR PROD NANOMATERIALS·Filed 2004·Granted Jul 18, 2006·50 cites·22 claims
- 0492US7029508B2Catalyst attached to solid and used to promote free radical formation in CMP formulationsDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Apr 18, 2006·56 cites·86 claims
- 0591US7513920B2Free radical-forming activator attached to solid and used to enhance CMP formulationsDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Apr 7, 2009·17 cites·7 claims
- 0691US7427305B2Free radical-forming activator attached to solid and used to enhance CMP formulationsDUPONT AIR PROD NANOMATERIALS·Filed 2006·Granted Sep 23, 2008·16 cites·21 claims
- 0791US6893476B2Composition and associated methods for chemical mechanical planarization having high selectivity for metal removalDUPONT AIR PROD NANOMATERIALS·Filed 2002·Granted May 17, 2005·52 cites·16 claims
- 0890US7153335B2Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazoleDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Dec 26, 2006·33 cites·16 claims
- 0990US6979252B1Low defectivity product slurry for CMP and associated production methodDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Dec 27, 2005·23 cites·13 claims
- 1089US7915071B2Method for chemical mechanical planarization of chalcogenide materialsDUPONT AIR PROD NANOMATERIALS·Filed 2008·Granted Mar 29, 2011·17 cites·15 claims
- 1188US7514363B2Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for useDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Apr 7, 2009·13 cites·20 claims
- 1288US7014669B2Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with sameDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Mar 21, 2006·32 cites·92 claims
- 1387US7022255B2Chemical-mechanical planarization composition with nitrogen containing polymer and method for useDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Apr 4, 2006·36 cites·16 claims
- 1486US6743267B2Gel-free colloidal abrasive polishing compositions and associated methodsDUPONT AIR PROD NANOMATERIALS·Filed 2002·Granted Jun 1, 2004·38 cites·13 claims
- 1585US7678605B2Method for chemical mechanical planarization of chalcogenide materialsDUPONT AIR PROD NANOMATERIALS·Filed 2008·Granted Mar 16, 2010·10 cites·18 claims
- 1685US7351662B2Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarizationDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Apr 1, 2008·11 cites·23 claims
- 1782US7427361B2Particulate or particle-bound chelating agentsDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Sep 23, 2008·39 cites·15 claims
- 1881US7476620B2Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizersDUPONT AIR PROD NANOMATERIALS·Filed 2006·Granted Jan 13, 2009·8 cites·14 claims
- 1981US7316977B2Chemical-mechanical planarization composition having ketooxime compounds and associated method for useDUPONT AIR PROD NANOMATERIALS·Filed 2006·Granted Jan 8, 2008·7 cites·26 claims
- 2076US7247566B2CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizersDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Jul 24, 2007·23 cites·18 claims
- 2169US7033942B2Chemical mechanical polishing composition and processDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Apr 25, 2006·8 cites·29 claims
- 2261US7276180B2Chemical mechanical polishing composition and processDUPONT AIR PROD NANOMATERIALS·Filed 2003·Granted Oct 2, 2007·4 cites·20 claims
- 2360US7344988B2Alumina abrasive for chemical mechanical polishingDUPONT AIR PROD NANOMATERIALS·Filed 2004·Granted Mar 18, 2008·6 cites·25 claims
- 2459US7968465B2Periodic acid compositions for polishing ruthenium/low K substratesDUPONT AIR PROD NANOMATERIALS·Filed 2004·Granted Jun 28, 2011·9 cites·22 claims
- 2556US7316976B2Polishing method to reduce dishing of tungsten on a dielectricDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Jan 8, 2008·2 cites·29 claims
- 2656US2009029553A1Free radical-forming activator attached to solid and used to enhance CMP formulationsDUPONT AIR PROD NANOMATERIALS·Filed 2008·Application pending·0 cites
- 2755US7524346B2Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substratesDUPONT AIR PROD NANOMATERIALS·Filed 2002·Granted Apr 28, 2009·4 cites·48 claims
- 2854US7247179B2Composition and associated methods for chemical mechanical planarization having high selectivity for metal removalDUPONT AIR PROD NANOMATERIALS·Filed 2004·Granted Jul 24, 2007·3 cites·22 claims
- 2953US2009047870A1Reverse Shallow Trench Isolation ProcessDUPONT AIR PROD NANOMATERIALS·Filed 2008·Application pending·0 cites
- 3044US2011165777A1Method and Slurry for Tuning Low-K Versus Copper Removal Rates During Chemical Mechanical PolishingDUPONT AIR PROD NANOMATERIALS·Filed 2011·Application pending·0 cites
- 3144US2010081279A1Method for Forming Through-base Wafer Vias in Fabrication of Stacked DevicesDUPONT AIR PROD NANOMATERIALS·Filed 2008·Application pending·0 cites
- 3244US2009061630A1Method for Chemical Mechanical Planarization of A Metal-containing SubstrateDUPONT AIR PROD NANOMATERIALS·Filed 2008·Application pending·0 cites
- 3337US2011237079A1Method for exposing through-base wafer vias for fabrication of stacked devicesDUPONT AIR PROD NANOMATERIALS·Filed 2010·Application pending·0 cites
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