Assignee
ELECTROCHEMICALS INC
US·22 granted patents·1 pending application·487 citations·filing 1993–2005
Top patents by PatentIndex Score
23 records- 0192US5476580AProcesses for preparing a non-conductive substrate for electroplatingELECTROCHEMICALS INC·Filed 1994·Granted Dec 19, 1995·65 cites·19 claims
- 0290US7108795B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2005·Granted Sep 19, 2006·17 cites·11 claims
- 0388US5389270AComposition and process for preparing a non-conductive substrate for electroplatingELECTROCHEMICALS INC·Filed 1993·Granted Feb 14, 1995·47 cites·8 claims
- 0485US5725807ACarbon containing composition for electroplatingELECTROCHEMICALS INC·Filed 1995·Granted Mar 10, 1998·53 cites·87 claims
- 0584US6946027B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2004·Granted Sep 20, 2005·18 cites·46 claims
- 0682US6303181B1Direct metallization process employing a cationic conditioner and a binderELECTROCHEMICALS INC·Filed 2000·Granted Oct 16, 2001·16 cites·27 claims
- 0781US6710259B2Printed wiring boards and methods for making themELECTROCHEMICALS INC·Filed 2001·Granted Mar 23, 2004·12 cites·19 claims
- 0879US6716281B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2002·Granted Apr 6, 2004·19 cites·28 claims
- 0978US5690805ADirect metallization processELECTROCHEMICALS INC·Filed 1995·Granted Nov 25, 1997·35 cites·34 claims
- 1077US7351353B1Method for roughening copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2000·Granted Apr 1, 2008·19 cites·14 claims
- 1176US5492595AMethod for treating an oxidized copper filmELECTROCHEMICALS INC·Filed 1994·Granted Feb 20, 1996·50 cites·24 claims
- 1274US6440331B1Aqueous carbon composition and method for coating a non conductive substrateELECTROCHEMICALS INC·Filed 1999·Granted Aug 27, 2002·34 cites·47 claims
- 1372US7211204B2Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)ELECTROCHEMICALS INC·Filed 2003·Granted May 1, 2007·8 cites·9 claims
- 1468US7153445B2Method for roughening copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2001·Granted Dec 26, 2006·11 cites·14 claims
- 1565US6623787B2Method to improve the stability of dispersions of carbonELECTROCHEMICALS INC·Filed 2001·Granted Sep 23, 2003·5 cites·14 claims
- 1665US6454868B1Permanganate desmear process for printed wiring boardsELECTROCHEMICALS INC·Filed 2000·Granted Sep 24, 2002·13 cites·12 claims
- 1765US6171468B1Direct metallization processELECTROCHEMICALS INC·Filed 1997·Granted Jan 9, 2001·18 cites·28 claims
- 1863US7186923B2Printed wiring boards and methods for making themELECTROCHEMICALS INC·Filed 2003·Granted Mar 6, 2007·3 cites·20 claims
- 1960US6375731B1Conditioning of through holes and glassELECTROCHEMICALS INC·Filed 2000·Granted Apr 23, 2002·7 cites·8 claims
- 2057US6691912B2Methods of avoiding blowhole formation by conditioning through holes and glassELECTROCHEMICALS INC·Filed 2002·Granted Feb 17, 2004·6 cites·10 claims
- 2150US2006102879A1Methods to stop copper attach by alkaline etching agents such as ammonia and monoethanol amine (MEA)ELECTROCHEMICALS INC·Filed 2005·Application pending·0 cites
- 2249US6037020AUltrasonic mixing of through hole treating compositionsELECTROCHEMICALS INC·Filed 1997·Granted Mar 14, 2000·16 cites·27 claims
- 2349US5985040APermanganate desmear process for printed wiring boardsELECTROCHEMICALS INC·Filed 1998·Granted Nov 16, 1999·15 cites·24 claims
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