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ENDICOTT INTERCONECT TECHNOLOG
US2 patents
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US7442879B2Oct 28, 2008
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
ENDICOTT INTERCONECT TECHNOLOG23 citations91
US7449381B2Nov 11, 2008
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
ENDICOTT INTERCONECT TECHNOLOG10 citations82