Assignee
ENDICOTT INTERCONNECT TECH INC
US·120 granted patents·19 pending applications·1,681 citations·filing 2002–2013
Top patents by PatentIndex Score
139 records- 0198US7800916B2Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 21, 2010·80 cites·31 claims
- 0298US7292055B2Interposer for use with test apparatusENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 6, 2007·66 cites·9 claims
- 0397US7508076B2Information handling system including a circuitized substrate having a dielectric layer without continuous fibersENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 24, 2009·56 cites·18 claims
- 0497US7025607B1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 11, 2006·51 cites·18 claims
- 0596US7501839B2Interposer and test assembly for testing electronic devicesENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 10, 2009·39 cites·22 claims
- 0695US7595454B2Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 29, 2009·49 cites·22 claims
- 0794US7738249B2Circuitized substrate with internal cooling structure and electrical assembly utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 15, 2010·32 cites·22 claims
- 0894US6995322B2High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Feb 7, 2006·72 cites·29 claims
- 0993US6809269B2Circuitized substrate assembly and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2002·Granted Oct 26, 2004·36 cites·15 claims
- 1092US7841741B2LED lighting assembly and lamp utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 30, 2010·54 cites·20 claims
- 1192US7129732B1Substrate test apparatus and method of testing substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Oct 31, 2006·26 cites·15 claims
- 1291US7348677B2Method of providing printed circuit board with conductive holes and board resulting therefromENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 25, 2008·19 cites·16 claims
- 1391US7261466B2Imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 28, 2007·16 cites·20 claims
- 1491US6828514B2High speed circuit board and method for fabricationENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Dec 7, 2004·47 cites·17 claims
- 1590US7687722B2Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 30, 2010·25 cites·33 claims
- 1690US7629684B2Adjustable thickness thermal interposer and electronic package utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 8, 2009·20 cites·19 claims
- 1790US7470990B2Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Dec 30, 2008·16 cites·15 claims
- 1890US7235745B2Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 26, 2007·15 cites·10 claims
- 1989US7851906B2Flexible circuit electronic package with standoffsENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Dec 14, 2010·19 cites·24 claims
- 2089US7541058B2Method of making circuitized substrate with internal optical pathwayENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 2, 2009·20 cites·18 claims
- 2189US7511518B2Method of making an interposerENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·14 cites·10 claims
- 2289US7510912B2Method of making wirebond electronic package with enhanced chip pad designENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·17 cites·6 claims
- 2389US7293355B2Apparatus and method for making circuitized substrates in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 13, 2007·18 cites·12 claims
- 2488US7791897B2Multi-layer embedded capacitance and resistance substrate coreENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Sep 7, 2010·15 cites·14 claims
- 2588US7665207B2Method of making a multi-chip electronic package having laminate carrierENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Feb 23, 2010·16 cites·5 claims
- 2688US7441709B2Electronic card assemblyENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Oct 28, 2008·22 cites·15 claims
- 2788US7354197B2Imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 8, 2008·10 cites·20 claims
- 2888US7176383B2Printed circuit board with low cross-talk noiseENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Feb 13, 2007·34 cites·10 claims
- 2988US7142121B2Radio frequency device for tracking goodsENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 28, 2006·83 cites·8 claims
- 3087US7596863B2Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities thereinENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Oct 6, 2009·19 cites·10 claims
- 3187US7429510B2Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 30, 2008·15 cites·16 claims
- 3286US7384856B2Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 10, 2008·16 cites·19 claims
- 3385US7510324B2Method of inspecting articles using imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·9 cites·11 claims
- 3485US7490984B2Method of making an imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Feb 17, 2009·8 cites·15 claims
- 3584US7713767B2Method of making circuitized substrate with internal optical pathway using photolithographyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted May 11, 2010·13 cites·13 claims
- 3684US7541265B2Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 2, 2009·12 cites·16 claims
- 3784US7530167B2Method of making a printed circuit board with low cross-talk noiseENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted May 12, 2009·10 cites·10 claims
- 3884US7161810B2Stacked chip electronic package having laminate carrier and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 9, 2007·11 cites·22 claims
- 3983US7687724B2Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 30, 2010·11 cites·10 claims
- 4083US7646098B2Multilayered circuitized substrate with p-aramid dielectric layers and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Jan 12, 2010·9 cites·13 claims
- 4183US7547577B2Method of making circuitized substrate with solder paste connectionsENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 16, 2009·13 cites·18 claims
- 4283US7078816B2Circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Jul 18, 2006·23 cites·15 claims
- 4382US7294791B2Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 13, 2007·30 cites·10 claims
- 4482US7169313B2Plating method for circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 30, 2007·13 cites·15 claims
- 4581US7738631B2Energy discriminating scatter imaging systemENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 15, 2010·11 cites·20 claims
- 4681US7589283B2Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling systemENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 15, 2009·12 cites·19 claims
- 4781US7416996B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Aug 26, 2008·7 cites·14 claims
- 4881US7342183B2Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Mar 11, 2008·7 cites·19 claims
- 4981US7270845B2Dielectric composition for forming dielectric layer for use in circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Sep 18, 2007·19 cites·13 claims
- 5081US7211289B2Method of making multilayered printed circuit board with filled conductive holesENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted May 1, 2007·21 cites·10 claims
Showing the top 50 of 139 patent records by PatentIndex Score.
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