Assignee
ENDO TADASUKE
JP2 patents
Top patents by PatentIndex Score
US8465837B2Jun 18, 2013
Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
ENDO TADASUKE2 citations51
US8294268B2Oct 23, 2012
Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device
ENDO TADASUKE0 citations33