Assignee

ENGION CO LTD

KR·2 granted patents·0 citations·filing 2021–2021

Technology mixH01L2 H10P2 B32B1

Top patents by PatentIndex Score

2 records

0145US12431371B2Semiconductor chip delamination device and control method thereforENGION CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·33 claims
0241US12472738B2Semiconductor chip delamination apparatus deviceENGION CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·15 claims

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