Assignee
ENGLAND LUKE G
US·2 granted patents·2 pending applications·84 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0196US8937309B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Jan 20, 2015·48 cites·13 claims
- 0296US8552567B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Oct 8, 2013·36 cites·22 claims
- 0343US2009032925A1Packaging with a connection structureENGLAND LUKE G·Filed 2007·Application pending·0 cites
- 0439US2013075268A1Methods of Forming Through-Substrate ViasENGLAND LUKE G·Filed 2011·Application pending·0 cites
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