Assignee
ENTHONE OMI INC
US·35 granted patents·1,272 citations·filing 1990–1998
Top patents by PatentIndex Score
35 records- 0196US6261637B1Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabricationENTHONE OMI INC·Filed 1995·Granted Jul 17, 2001·269 cites·12 claims
- 0296US5328589AFunctional fluid additives for acid copper electroplating bathsENTHONE OMI INC·Filed 1992·Granted Jul 12, 1994·124 cites·21 claims
- 0392US6024856ACopper metallization of silicon wafers using insoluble anodesENTHONE OMI INC·Filed 1997·Granted Feb 15, 2000·186 cites·13 claims
- 0491US5435898AAlkaline zinc and zinc alloy electroplating baths and processesENTHONE OMI INC·Filed 1994·Granted Jul 25, 1995·82 cites·23 claims
- 0586US5368715AMethod and system for controlling plating bath parametersENTHONE OMI INC·Filed 1993·Granted Nov 29, 1994·81 cites·20 claims
- 0678US5730854AAlkoxylated dimercaptans as copper additives and de-polarizing additivesENTHONE OMI INC·Filed 1996·Granted Mar 24, 1998·33 cites·20 claims
- 0777US6013203ACoatings for EMI/RFI shieldingENTHONE OMI INC·Filed 1998·Granted Jan 11, 2000·38 cites·9 claims
- 0872US5182006AZincate solutions for treatment of aluminum and aluminum alloysENTHONE OMI INC·Filed 1991·Granted Jan 26, 1993·34 cites·13 claims
- 0970US5169514APlating compositions and processesENTHONE OMI INC·Filed 1991·Granted Dec 8, 1992·27 cites·18 claims
- 1069US6146702AElectroless nickel cobalt phosphorous composition and plating processENTHONE OMI INC·Filed 1997·Granted Nov 14, 2000·43 cites·14 claims
- 1167US5437887AMethod of preparing aluminum memory disksENTHONE OMI INC·Filed 1993·Granted Aug 1, 1995·30 cites·15 claims
- 1266US6183622B1Ductility additives for electrorefining and electrowinningENTHONE OMI INC·Filed 1998·Granted Feb 6, 2001·25 cites·6 claims
- 1364US5372741AAqueous degreasing composition and processENTHONE OMI INC·Filed 1991·Granted Dec 13, 1994·23 cites·30 claims
- 1462US5061351ABright tin electrodeposition compositionENTHONE OMI INC·Filed 1990·Granted Oct 29, 1991·15 cites·11 claims
- 1561US6054037AHalogen additives for alkaline copper use for plating zinc die castingsENTHONE OMI INC·Filed 1998·Granted Apr 25, 2000·14 cites·14 claims
- 1660US5108552AElectroplating processENTHONE OMI INC·Filed 1991·Granted Apr 28, 1992·21 cites·10 claims
- 1757US5525206ABrightening additive for tungsten alloy electroplateENTHONE OMI INC·Filed 1995·Granted Jun 11, 1996·13 cites·20 claims
- 1857US5192461AAqueous degreasing solution having high free alkalinityENTHONE OMI INC·Filed 1991·Granted Mar 9, 1993·22 cites·42 claims
- 1955US5853556AUse of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloysENTHONE OMI INC·Filed 1997·Granted Dec 29, 1998·12 cites·20 claims
- 2054US6045682ADuctility agents for nickel-tungsten alloysENTHONE OMI INC·Filed 1998·Granted Apr 4, 2000·14 cites·20 claims
- 2153US5578187APlating process for electroless nickel on zinc die castingsENTHONE OMI INC·Filed 1995·Granted Nov 26, 1996·20 cites·7 claims
- 2252US6080447ALow etch alkaline zincate composition and process for zincating aluminumENTHONE OMI INC·Filed 1998·Granted Jun 27, 2000·20 cites·10 claims
- 2352US5376248ADirect metallization processENTHONE OMI INC·Filed 1991·Granted Dec 27, 1994·20 cites·12 claims
- 2451US5415685AElectroplating bath and process for white palladiumENTHONE OMI INC·Filed 1993·Granted May 16, 1995·10 cites·14 claims
- 2549US5358602AMethod for manufacture of printed circuit boardsENTHONE OMI INC·Filed 1993·Granted Oct 25, 1994·17 cites·14 claims
- 2646US5486272AElectroplating method and apparatusENTHONE OMI INC·Filed 1994·Granted Jan 23, 1996·11 cites·13 claims
- 2745US5998237AMethod for adding layers to a PWB which yields high levels of copper to dielectric adhesionENTHONE OMI INC·Filed 1996·Granted Dec 7, 1999·15 cites·14 claims
- 2844US5733429APolyacrylic acid additives for copper electrorefining and electrowinningENTHONE OMI INC·Filed 1996·Granted Mar 31, 1998·6 cites·20 claims
- 2943US5928435AMethod for removing organic coatings from substrates using carboxylic acids, organic solvents, and corrosion inhibitorsENTHONE OMI INC·Filed 1998·Granted Jul 27, 1999·11 cites·16 claims
- 3036US5630950ACopper brightening process and bathENTHONE OMI INC·Filed 1994·Granted May 20, 1997·8 cites·31 claims
- 3135US5108786AMethod of making printed circuit boardsENTHONE OMI INC·Filed 1990·Granted Apr 28, 1992·5 cites·10 claims
- 3233US5178690AProcess for sealing chromate conversion coatings on electrodeposited zincENTHONE OMI INC·Filed 1992·Granted Jan 12, 1993·12 cites·9 claims
- 3332US5730809APassivate for tungsten alloy electroplatingENTHONE OMI INC·Filed 1994·Granted Mar 24, 1998·1 cites·12 claims
- 3427US5368718AElectrowinning of direct metallization acceleratorsENTHONE OMI INC·Filed 1993·Granted Nov 29, 1994·4 cites·5 claims
- 3524US5266212APurification of cyanide-free copper plating bathsENTHONE OMI INC·Filed 1992·Granted Nov 30, 1993·6 cites·20 claims
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