Assignee
ERA NAOHIKO
JP·3 granted patents·15 citations·filing 2006–2008
Top patents by PatentIndex Score
3 records- 0181US8317948B2Copper alloy for electronic materialsERA NAOHIKO·Filed 2006·Granted Nov 27, 2012·6 cites·6 claims
- 0274US8444779B2Cu—Ni—Si—Co copper alloy for electronic materials and method for manufacturing sameERA NAOHIKO·Filed 2008·Granted May 21, 2013·4 cites·7 claims
- 0368US8070893B2Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing sameERA NAOHIKO·Filed 2006·Granted Dec 6, 2011·5 cites·4 claims
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